APD1 外延切割機(jī)

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• 更新時(shí)間：2016-04-19

產(chǎn)品簡(jiǎn)介：

The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm

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The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter.  It is also suitable for precision dicing of wafers up to 100mm in diameter.

Ø Easy Operation

Ø Annular Cutting Mode

Ø Peripheral Cutting Mode

Ø Typical Applications

The APD1 will prove an effective tool in applications such as:

• cutting & wafering of crystals

• sectioning of electronic components

• dicing semiconductor components

• slotting to depth

and the cutting of a wide range of materials, such as:

• glasses

• ceramics

• rock samples

• opto-electronic materials.